Advanced PCB Assembly Solutions

NovaCircuits' Advanced PCB Assembly Solutions encompass a full spectrum of manufacturing capabilities tailored to the electronics industry's evolving demands. Our entry-level service provides cost-effective standard assembly for through-hole and surface-mount components, ideal for prototyping and low-volume production runs. The advanced tier introduces HDI technology with 50μm line spacing, enabling miniaturization for wearable devices and IoT sensors. Our premium offering integrates heterogeneous integration techniques, combining rigid-flex PCBs with embedded components for medical implant devices and aerospace applications.
All solutions undergo rigorous quality control protocols, including X-ray inspection for BGA solder joints and thermal cycling tests (-40°C to +125°C). We maintain a component inventory of over 10,000 SKUs, ensuring rapid response to customer requirements. Our engineering support includes DFM (Design for Manufacturability) analysis and DFMEA (Design Failure Mode and Effects Analysis) to optimize production yield. Recent innovations include implementing Industry 4.0 principles with real-time production monitoring and traceability from component receipt to final shipment.